Industry expert analysis is combined with detailed SEM and TEM images, TEM-EDS and TEM-EELS data to provide in-depth analyses of the structures and materials used to fabricate state-of-the-art integrated circuits. Process features such as the substrate, isolation; peripheral, I/O and high voltage transistors; dielectrics, metallization, passive components, SRAM and standard logic layout are included in these industry leading reports. Example Table of Contents Executive Summary Major Findings Device Summary Process Summary Package and Die Overview Process 6T SRAM Cell (plan view and cross-sectional) Materials Analysis Critical Dimensions