• The report contents will contain the following features:

    • Package photos (top and bottom)
    • Package measurements
    • Package X-Ray (top and side for multichip devices)
    • Decapsulation and die photo at top metal
    • Die marking(s) photo at top metal
    • Die cross-section image of minimum observed transistor; process node estimation.
    • Die cross-section images of process layers (3 max)

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