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Deep Dive Teardown of the Humminbird HELIX 9 Mega SI G2N GPS Fishfinder and Chartplotter

Report | Key: DDT-1806-901 | ID: DDT-1806-901 | Published: 15 October 2018

Product Type Fishfinder/Chartplotter Brand Humminbird Device Name HELIX Device Model # 9 CHIRP MEGA SI GPS G2N Official Release... ~ (Similar Results)
Quick Survey Teardown of the Oppo A73 Smartphone

Report | Key: QST-1808-807 | ID: QST-1808-807 | Published: 15 October 2018

Product Type Smartphone Brand Oppo Device Name A73 Official Release Date 20/12/2017 Country of Purchase China Retail... ~ (Similar Results)
Quick Survey Teardown of the Samsung Galaxy Tab A SM-T585 LTE Tablet

Report | Key: QST-1808-812 | ID: QST-1808-812 | Published: 15 October 2018

Product Type Tablet Brand Samsung Device Name Galaxy Tab A Device Model # SM-T585 Official Release Date 01/06/2016 ... ~ (Similar Results)
Texas Instruments XCC1352R1F3RGZ Dual-Band Wireless MCU Basic Functional Analysis

Report | Key: FAR-1808-805 | ID: FAR-1808-805 | Published: 5 October 2018

This report presents a Basic Functional Analysis of the Texas Instruments F771685B die found inside the Texas Instruments XCC1352R1F3RGZ component. This report contains the following detailed information:... ~ (Similar Results)
Samsung KM3H6001CM-B515 eMMC 5.1 NAND Flash Memory Functional Analysis

Report | Key: MFR-1807-801 | ID: MFR-1807-801 | Published: 5 October 2018

This report presents a Memory Functional Analysis of the Samsung K9GFGD8U0M 3D V-NAND die found inside the Samsung KM3H6001CM-B515. This report contains the following detailed information: Selected... ~ (Similar Results)
Marvell 88MW300-NAP2 Wi-Fi Microcontroller SoC Basic Functional Analysis

Report | Key: FAR-1808-804 | ID: FAR-1808-804 | Published: 5 October 2018

This report presents a Basic Functional Analysis of the Marvell KINGLET.2.1.1 die found inside the Marvell 88MW300-NAP2. The 88MW300-NAP2 was extracted from the Panasonic ENW49C01A3KF. This report contains... ~ (Similar Results)
Samsung S5K4H7YX Basic Functional Analysis Report

Report | Key: FAR-1808-903 | ID: FAR-1808-903 | Published: 2 October 2018

This report presents a Basic Functional Analysis of the Samsung S5K4H7YX BI CIS found inside the front camera module of the Meizu M712Q-B Meilan S6. This report contains the following detailed information:... ~ (Similar Results)
Quick Turn Teardown of the Apple iPhone Xs Max Smartphone

Report | Key: QTT-1809-801 | ID: QTT-1809-801 | Published: 28 September 2018

~ (Similar Results)
Deep Dive Teardown of the Intel RealSense D435 Camera

Report | Key: DDT-1807-804 | ID: DDT-1807-804 | Published: 28 September 2018

Product Type Camera Brand Intel Device Name RealSense Camera Device Model # D435 Official Release Date 18/01/2018 ... ~ (Similar Results)
Quick Survey Teardown of the Xiaomi Mi Pad 4 M1806D9E Tablet

Report | Key: QST-1808-804 | ID: QST-1808-804 | Published: 28 September 2018

The Bill of Materials files are Excel files that contain all of the costing materials gathered during the physical teardown and analysis of the device. This information is broken up into several tabs... ~ (Similar Results)

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