Interested in this report?

Published: 13 February 2018

This report presents a Basic Functional Analysis of the STMicroelectronics S2L012AC die found inside the STMicroelectronics K1MC and K1E8 ToF sensor packages. The K1MC package was extracted from the Apple iPhone 8 Plus model A1897 and the K1E8 package from the iPhone 7 Plus model A1784.

This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to the polysilicon layer
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

Report Description

This report presents a Basic Functional Analysis of the STMicroelectronics S2L012AC die found inside the STMicroelectronics K1MC and K1E8 ToF sensor packages. The K1MC package was extracted from the Apple iPhone 8 Plus model A1897 and the K1E8 package from the iPhone 7 Plus model A1784.

Recent OMR Reports

FAR-1805-803  |   Published: 18 July 2018
This report presents a Digital Functional Analysis of the i3-8121U die found inside the Intel i3-8121U Cannon Lake laptop processor. This report contains the following detailed information: Selected...
SCE-1802-803  |   Published: 17 July 2018
This project presents a Standard Cell Essentials analysis of the HiSilicon Hi3670 Kirin 970 dummy structures. It is a collection of SEM montage images showing transition regions between an I/O IP block...
ARC-1803-801  |   Published: 17 July 2018
This report presents a radio frequency (RF) Architecture Analysis of the Samsung Shannon_955. This device is an RF transceiver. The following report contains annotated photographs and circuit architecture diagrams divided into the following sections: General Overview RF Architecture