This report presents a Basic Functional Analysis of the STMicroelectronics S2L012AC die found inside the STMicroelectronics K1MC and K1E8 ToF sensor packages. The K1MC package was extracted from the Apple iPhone 8 Plus model A1897 and the K1E8 package from the iPhone 7 Plus model A1784.

This report contains the following detailed information:

• Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
• Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
• Measurements of vertical and horizontal dimensions of major microstructural features
• Plan-view optical micrograph of the die delayered to the polysilicon layer
• Identification of major functional blocks on a polysilicon die photograph
• Table of functional block sizes and percentage die utilization
• High-resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
• Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process