Product Code
FAR-1709-802
Release Date
Availability
Published
Product Item Code
APP-APL1W72
Device Manufacturer
Apple
Device Type
Applications Processor
Subscription
Logic
Channel
Logic - Digital Floorplan (IP)
Logic - Digital Floorplan
Apple A11 Bionic APL1W72 Application Processor Digital Functional Analysis
This report presents a Digital Functional Analysis of the TMHS09 die found inside the Apple A11 Bionic APL1W72 application processor. This report contains the following detailed information:
  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) plan-view micrographs showing the layout of the die at the levels including, fin/STI, gate, contacts, and minimum pitch metals
  • Measurements of horizontal dimensions of some of the major layout features, particularly the pitch and track height of standard cells
  • Plan-view optical micrograph of the die delayered to the metal gate level
  • Identification of major functional blocks on a gate level die photograph
  • Table of functional block sizes and percentage die utilization
  • High-resolution top metal and gate level die photographs delivered in the ICWorks Browser
 

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