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Published: 8 December 2016

This report presents a basic Functional Analysis of the Apple 343S00131 die found inside the Apple 343S00131 molded-array BGA package. This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • SEM cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process

Product Teardown Report Description

This report presents a basic Functional Analysis of the Apple 343S00131 die found inside the Apple 343S00131 molded-array BGA package.

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