This report presents a Basic Functional Analysis of the Egis Technology ET300 die found inside Egis Technology ET300 component. This report contains the following detailed information:

Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs

Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors

Measurements of vertical and horizontal dimensions of major microstructural features

Plan-view optical micrograph of the die delayered to polysilicon

Identification of major functional blocks on a polysilicon die photograph

Table of functional block sizes and percentage die utilization

High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser

Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process