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Published: 13 June 2016

This report presents a Basic Functional Analysis of the Egis Technology ET300 die found inside Egis Technology ET300 component. This report contains the following detailed information:

  • Selected teardown photographs, package photographs, package X-rays, die markings, and die photographs
  • Scanning electron microscopy (SEM) cross-sectional micrographs of the general structure of the die dielectric materials, major features, and transistors
  • Measurements of vertical and horizontal dimensions of major microstructural features
  • Plan-view optical micrograph of the die delayered to polysilicon
  • Identification of major functional blocks on a polysilicon die photograph
  • Table of functional block sizes and percentage die utilization
  • High resolution top metal and polysilicon die photographs delivered in the ICWorks Browser
  • Cost of die and tested packaged die, based on the manufacturing cost analysis of the observed process
  • Report Description

    This report presents a Basic Functional Analysis of the Egis Technology ET300 die found inside Egis Technology ET300 component.

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