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Published: 27 March 2017

This report presents a Partial Circuit Analysis of the SPAD array of the STMicroelectronics S3L012BA die found inside the VL53L0B time-of-flight (ToF) sensor module. The S3L012BA is made in a 130 nm CMOS process using four metal layers and one polysilicon layer.

This Partial Circuit Analysis report presents the following functional blocks of the device:

  • HV Generation
  • SPAD Array (Active and Dark)
  • Proximity Clock Generator
  • IR Emitter Driver
  • Clock Buffers
  • PLL
  • PMU
  • Bandgap Reference Generator
  • Voltage Detector
  • Control Circuit
  • Test Circuit
  • ESDs
  • IR Driver ESDs
  • Supply ESDs
  • Capacitors and Diodes

Report Description

This report presents a Partial Circuit Analysis of the SPAD array of the STMicroelectronics S3L012BA die found inside the VL53L0B time-of-flight (ToF) sensor module.

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