Product Code
ACE-1708-801
Release Date
Availability
Published
Product Item Code
SAM-KUS020203M-B000
Device Manufacturer
Samsung
Device Type
Multi Chip Package
Subscription
Packaging
Channel
Advanced Packaging - Process
Samsung KUS020203M-B000 PM971 NVMe SSD PoP BGA Package ACMOS Essentials - Advanced Packaging
The Advanced CMOS Essentials (ACE) deliverable for NAND flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following image folders:
  • Downstream product teardown
  • Package X-rays, top metal and poly die photographs, non-invasive optical photos of die features
  • SEM bevel through the logic region and NAND flash
  • SEM cross section of the general device structure, BEOL (metals, dielectrics) and FEOL structures
  • One (or two) TEM cross sections, orthogonal to the word and/or bit lines, showing the NAND flash array cells, lower metals and dielectrics, transistor gates, isolation, and other FEOL features
  • TEM bevel through the NAND flash
The results of TEM-EDS analyses are included in the ACE summary document. The ACE deliverable provides timely competitive benchmarking information and enables cost-effective tracking of technical innovation across a breadth of competitors.
 

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