Interested in this report?

Published: 15 January 2014

The following IC Design Overview contains a summary of packaging details and a breakdown of logic, I/O and embedded memory areas for this device. Included in this analysis are images of the package, die and die markings. Package analysis includes a summary of package measurements, external top and bottom images, a package cross-section image, and multiple package x-ray images. A die cross-section image is included to show die thickness. Annotated die images show locations of I/O, embedded memory, standard logic, and major repeating mixed-signal blocks. Representative images of I/O blocks, embedded memory types, and standard logic gates are also included. This report also comes with 30 minutes of analyst time that is to be used within 6 months of the report’s purchase.

Recent OMR Reports

Buy Now  |   Price: $19,500.00 (USD)   |   Report  |  ACE-1707-801  |   Published: 4 December 2017
The Advanced CMOS Essentials (ACE) deliverable for NAND flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the in-depth...
Buy Now  |   Price: $19,500.00 (USD)   |   Report  |  ACE-1708-801  |   Published: 1 December 2017
The Advanced CMOS Essentials (ACE) deliverable for NAND flash chips comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following...
Buy Now  |   Price: $7,500.00 (USD)   |   Report  |  FAR-1708-803  |   Published: 30 November 2017
This report presents a Digital Functional Analysis of the NVIDIA T186-A01 die found inside the NVIDIA TE770D-A2 component. The NVIDIA TE770D-A2 was extracted from the NVIDIA Jetson TX2 P3310. This report...