Interested in this report?

Published: 15 January 2014

The following IC Design Overview contains a summary of packaging details and a breakdown of logic, I/O and embedded memory areas for this device. Included in this analysis are images of the package, die and die markings. Package analysis includes a summary of package measurements, external top and bottom images, a package cross-section image, and multiple package x-ray images. A die cross-section image is included to show die thickness. Annotated die images show locations of I/O, embedded memory, standard logic, and major repeating mixed-signal blocks. Representative images of I/O blocks, embedded memory types, and standard logic gates are also included. This report also comes with 30 minutes of analyst time that is to be used within 6 months of the report’s purchase.

Recent OMR Reports

DEF-1803-803  |   Published: 19 April 2018
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders: ...
DEF-1803-802  |   Published: 19 April 2018
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders: ...
FAR-1801-802  |   Published: 6 April 2018
This report presents a Digital Functional Analysis of the Intel SKX die found inside the Intel CD8067303593400S R3KE Xeon Gold 6126F server processor, which is designed for the server market. Intel has...