Interested in this report?

Published: 17 February 2014

The following IC Design Overview contains a summary of packaging details and a breakdown of logic, I/O and embedded memory areas for this device. Included in this analysis are images of the package, die and die markings. Package analysis includes a summary of package measurements, external top and bottom images, a package cross-section image, and multiple package x-ray images. A die cross-section image is included to show die thickness. Annotated die images show locations of I/O, embedded memory, standard logic, and major repeating mixed-signal blocks. Representative images of I/O blocks, embedded memory types, and standard logic gates are also included. This report also comes with 30 minutes of analyst time that is to be used within 6 months of the report’s purchase.

Recent OMR Reports

Buy Now  |   Price: $4,000.00 (USD)   |   Report  |  QST-1704-801  |   Published: 19 April 2017
The Bill of Materials files are Excel files that contain all of the costing materials gathered during the physical teardown and analysis of the device. This information is broken up into several tabs...
Buy Now  |   Price: $6,999.00 (USD)   |   Report  |  BOM-1704-806  |   Published: 19 April 2017
The Bill of Materials files are Excel files that contain all of the costing materials gathered during the physical teardown and analysis of the device. This information is broken up into several tabs...
Buy Now  |   Price: $4,999.00 (USD)   |   Report  |  BOM-1704-805  |   Published: 12 April 2017
The Bill of Materials files are Excel files that contain all of the costing materials gathered during the physical teardown and analysis of the device. This information is broken up into several tabs...