Interested in this report?

Published: 15 April 2011

UBM Techinsights’ Memory Detailed Structural Analysis (MDSA) report provides comprehensive analysis of the process technology, design rules, and memory cell configuration used to manufacture a particular memory IC. The analysis is based on SEM, TEM, EELS, EDS, X-ray, SRP techniques and comprises: device overview (package, die, die markings, bond pads, die corners, edge seal, fuses), and general process and memory cell analyses.

General Process Analysis delivers a characterization of die levels from substrate to passivation, including FEOL and BEOL with critical dimensions by SEM/TEM/SRP and materials identification by TEM EDS. Other analytical methods (e.g. SIMS, SCM) may be used, if necessary. Memory Cell Analysis includes layer-by-layer SEM topographical imaging of the memory cell array and pitch circuitry (sense amplifiers, wordline decoders) at different levels from substrate to metal 2.

SEM cross-sections of memory array in both bitline and wordline directions (and TEM cross-section in one of the directions) provide detailed information on memory cell, including critical dimensions of cell elements (transistor, contacts, capacitor, etc.) and material identification (pre-metal dielectrics, capacitor electrodes, silicide layers, capacitor dielectric, inter-metal dielectrics, etc.).

All key innovative features used for a particular device are highlighted in the Major Findings and Executive Summary sections of the report.

MDSA reports help managers, engineers and researchers to:
• increase market share by penetrating market faster with appropriate products;
• track key innovations used for a certain memory type (critical dimensions and design rules, new materials and modified structures, etc.);
• reduce the risk of investments in new processes and equipment;
• reduce process development expenditures;
• support informed decision making on where to invest and which technical resources to invest in; and
• support IP campaigns with valuable “Evidence of Use” information of various process features.

Recent OMR Reports

Report  |  1016-43837-O-6CV-100  |   Published: 31 March 2017
This CircuitVision report provides a set of hierarchical schematics for the Intel 5750 RF Transceiver. The circuit blocks extracted and analyzed for the report include the Transmit Path, Dual-Channel Receive...
Report  |  1116-44368-O-6CV-100  |   Published: 30 March 2017
Qualcomm UA630 Envelope Tracker contains single QFE3100 IC device in addition to surface mount components. The main Envelope Tracker die consists of boost regulators, linear regulator, average power tracking,...
Report  |  0317-44608-O-6CV-100  |   Published: 13 March 2017
Skyworks SKY78100 Power Amplifier Module contains several separate devices (Power Amplifier, Power Amplifier Controller, RF Switches and Duplexers) in addition to surface mount components. Power Amplifier...