Interested in this report?

Published: 9 May 2011

The following report contains a summary of packaging and a breakdown of logic, I/O and embedded memory areas for this device. Included in this analysis are images of the package, die and die markings. Package analysis includes a summary of package measurements, external top and bottom images, a package cross-section image, and multiple package x-ray images. A die cross-section image is included to show die thickness. Annotated die images show locations of I/O, embedded memory, standard logic, and major repeating mixed-signal blocks. Representative images of I/O blocks, embedded memory types, and standard logic gates are also included. This report also comes with 30 minutes of analyst time that is to be used within 6 months of the report’s purchase.

Recent OMR Reports

Buy Now  |   Price: $9,000.00 (USD)   |   Report  |  DEF-1712-801  |   Published: 2 February 2018
The Device Essentials deliverable for imaging devices includes a one page summary of observed device metrics and salient features. The summary is supported by the following unannotated image folders:...
Buy Now  |   Price: $19,500.00 (USD)   |   Report  |  ACE-1708-804  |   Published: 31 January 2018
The Advanced CMOS Essentials (ACE) deliverable for Advanced Packaging comprises a concise analyst’s summary document highlighting observed critical dimensions and salient features supported by the following...
Buy Now  |   Price: $7,500.00 (USD)   |   Report  |  FAR-1711-902  |   Published: 26 January 2018
This report presents a Basic Functional Analysis of the BCM15951 die found inside the Broadcom BCM15951B0KUB2G package. The BCM15951B0KUB2G package was extracted from the Apple iPhone X A1901. This report...