IC Design Overview of the NVIDIA Tegra 250 Processor

Published: 9 May 2011

The following report contains a summary of packaging and a breakdown of logic, I/O and embedded memory areas for this device. Included in this analysis are images of the package, die and die markings. Package analysis includes a summary of package measurements, external top and bottom images, a package cross-section image, and multiple package x-ray images. A die cross-section image is included to show die thickness. Annotated die images show locations of I/O, embedded memory, standard logic, and major repeating mixed-signal blocks. Representative images of I/O blocks, embedded memory types, and standard logic gates are also included. This report also comes with 30 minutes of analyst time that is to be used within 6 months of the report’s purchase.

Other Functional Analysis Reports Other NVIDIA Reports Search All Reports

Related Devices:

NVIDIA L912B766

Recent OMR Reports

  • Report  |  1014-37935-O-5DM-101  |   Published: 31 December 2014
    This report is a detailed structural analysis of the SK Hynix H2JTDG8UD1BMS, 16 GB, 16 nm node MLC NAND Flash memory used in the Apple iPhone 6 Plus smartphone. The device is fabricated using a three...
  • Report  |  1214-37469-O-5TC-100  |   Published: 26 December 2014
    The transistor characteristics report of the Samsung K9HQGY8S5M 3D V-NAND Flash Memory provides analysis on the DC electrical properties of the logic NMOS and PMOS transistors. The transistor report includes...
  • Report  |  1214-36281-O-6CV-100  |   Published: 24 December 2014
    This CircuitVision report provides a set of hierarchical schematics for the Nanya NT5CB128M16HP 42 nm DDR3 SDRAM. The circuit blocks extracted and analyzed for the report include the sense amplifier, SP/SN...