Interested in this report?

Published: 9 February 2017

Product Type Laptop
Brand Xiaomi
Device Name Mi Air 13
Device Model # 161301-01
Official Release Date 11/11/2016 ?
Target Market China
Retail Price $735.00
Weight (grams) 1310 (Measured)
Device Dimensions (mm) 309.57 x 210.97 x 13.11 (Measured at Longest/Widest/Thickest Points)
Product Features
Operating System Windows 10 Home Edition
Processor Spec 2.3 GHz Dual-Core Intel Core i5 (i5-6200U) + NVIDIA GeForce 940MX Graphics Card
Communications N/A
Connectivity WiFi 802.11b/g/n/ac, Bluetooth 4.1, HDMI,
USB 3.0 (2x), USB Type-C, Headset Jack
User Interface Full QWERTY Keyboard, Touchpad
Storage Internal: 256 GB 3D V-NAND Flash (SSD)
External: N/A
Sensors Hall Effect Sensor, Temperature Sensor (SSD)
Battery Type 7.6 V, 5107 mAh, Li-Polymer
Battery Life (Hrs.) Use Time: 9.5; Standby Time: N/A
Display 13.3" TFT-LCD, 1920 x 1080 Pixels, 16,777,216 Colors, Gorilla Glass
Front Camera 1 MP CMOS Webcam, 720p HD

Product Teardown Report Description

A Deep Dive report is a detailed product disassembly analysis that examines the latest personal electronics and provides unique construction, benchmarking, and cost data in a highly-digestible and graphics-rich format. The products are torn down using proprietary methods developed at TechInsights to provide a disassembly report with a multi-disciplinary "system view."

Recent OMR Reports

Buy Now  |   Price: $7,500.00 (USD)   |   Report  |  FAR-1708-801  |   Published: 17 October 2017
This report presents a Digital Functional Analysis of the AMD 2V5-089400-00 die found inside the AMD 215-0894252 graphics processor. The 215-0894252 was extracted from an AMD Radeon Vega Frontier Edition...
Buy Now  |   Price: $12,000.00 (USD)   |   Report  |  EXR-1707-801  |   Published: 12 October 2017
The report summarizes an exploratory analysis of the Samsung K3UH5H50MM-NGCJ low power DDR4X mobile DRAM extracted from the Samsung Galaxy S8 (model SM-G950W). The Samsung K3UH5H50MM-NGCJ contains the...
Buy Now  |   Price: $75,000.00 (USD)   |   Report  |  SAR-1706-801  |   Published: 6 October 2017
This report presents a Structural Analysis of the XPoint memory die extracted from the Intel 29P16B1BLDNF2 device. The 3D XPoint memory is a first-of-its-kind non-volatile memory (NVM). The XPoint memory...