Interested in this report?

Published: 30 March 2016

This CircuitVision analysis covers circuit extraction, analysis and organization of all unique circuit blocks on a single die in the SK Hynix H9HKNNNBTUMU LPDDR4 Mobile DRAM. This Analysis includes the following chapters: • Architectural Overview • Data Path • Address Path • Voltage Generator System • Command, Control and Test Circuitry

Recent OMR Reports

EXR-1804-803  |   Published: 8 June 2018
This report presents an Exploratory Analysis of the DRAM die, with the markings K4F2A164HF, found in the Samsung S5K2L3SX rear camera module extracted from a Samsung Galaxy S9+ (model SM-G965N) smartphone.
FAR-1804-803  |   Published: 7 June 2018
This report presents a Digital Functional Analysis of the MediaTek MT6771V Helio P60 chipset’s AM10788B die, found inside the OPPO PACM00 R15 smartphone. The MediaTek MT6771V Helio P60 chipset, manufactured...
IPR-1802-801  |   Published: 6 June 2018
This report is an Imager Process Review of the Samsung S5K2X7SP 24 megapixel (MP) stacked BI CIS extracted from the Vivo V7+ smartphone’s front-facing camera. The S5K2X7SP is the first image sensor with...