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TechInsights has amassed over 8500 'open market' reports that are available for resale.  They include teardowns, quick looks, detailed structural analysis, circuit analysis, package construction analysis and process transistor characteristics, to name a few.  Search for a report of interest by keywords, type, part number, manufacturer and other characteristics.  View some sample reports here.

  • Report  |  1114-37071-O-5SA-100  |   Published: 30 April 2015
    This report provides a custom structural of the pixel used in the 18.10 megapixel CMOS image sensor taken from a Canon EOS Rebel T3i DSLR camera. The EOS Rebel T3i is an easy to use compact DSLR camera...
  • Report  |  0215-37074-O-5CS-100  |   Published: 27 February 2015
    This report is a custom structural of the Sony IMX206, 16 megapixel, backside illuminated (BSI) CMOS image sensor pixel. The IMX206 (BSI) ExmorTM CMOS image sensor is used in the Canon SX600 HS and SX700...
  • Report  |  0115-38660-O-6CV-100  |   Published: 13 February 2015
    This CircuitVision report provides a set of hierarchical schematics for the Mediatek MT6628QP Wireless Combo IC . The device used to complete this analysis was sourced in Taiwan. The circuit blocks extracted...
  • Report  |  0215-36490-O-5CV-100  |   Published: 13 February 2015
    This CircuitVision report provides a set of hierarchical schematics for the Qualcomm WTR1625L RF Transceiver. The circuit blocks extracted and analyzed for the report include the Receive PLL. This report...
  • Report  |  1114-37985-O-6CV-100  |   Published: 30 January 2015
    This CircuitVision report provides a set of hierarchical schematics for the embedded transmit mixer circuit found in the Qualcomm Atheros WCN3680B Wi-Fi/Bluetooth®/FM Solution Chip. The circuit blocks...
  • Report  |  1214-38503-O-4ML3-100  |   Published: 1 January 2015
    This report provides a brief technical snapshot of the NVIDIA Tegra K1 Processor from the HTC Nexus 9 Tablet. The report includes: High resolution optical images of the package top and bottom, x-ray images...
  • Report  |  1114-38108-O-4ML3-100  |   Published: 1 January 2015
    This report provides a brief technical snapshot of the Apple APL1012 A8 System on Chip (SoC) Applications Processor from the Apple iPad Air 2. The report includes: High resolution optical images of the...
  • Report  |  1014-37935-O-4SL1-100  |   Published: 1 January 2015
    This report provides a brief technical snapshot of the SK Hynix H2JTDG8UD1BMS 16 nm NAND Flash from the Apple iPhone 6 Plus Smartphone. The report includes: High resolution optical images of the package...
  • Report  |  0714-37069-O-5SA-100  |   Published: 31 December 2014
    This report is a structural analysis of the 18.1 megapixel, 6.9 µm x 6.9 µm pixel, CMOS image sensor used in the Canon EOS-1D X DSLR camera. The EOS-1D X camera features a full-frame 18.1 megapixel (5184...
  • Report  |  1014-37935-O-5DM-101  |   Published: 31 December 2014
    This report is a detailed structural analysis of the SK Hynix H2JTDG8UD1BMS, 16 GB, 16 nm node MLC NAND Flash memory used in the Apple iPhone 6 Plus smartphone. The device is fabricated using a three...