Accurate, referenceable information is critical for making business decisions. TechInsights has been publishing technology analysis for over 30 years, revealing the innovation others cannot and enabling our customers to advance their intellectual property and product strategies.
With a historic archive of over 12,000reports, and hundreds of new reports published each year, the TechInsights has the world’s largest archive of reverse engineering analysis on semiconductor and consumer products.
Reports are available for individual purchase, and they are classified by type of analysis, product type, component type, and manufacturer, making it easy to find the information you need.
TechInsights reports enable fact-based IP decisions in support of licensing, defense, acquisition, divestiture, and prosecution projects. Our reports are used by legal personnel, program managers, and engineers to:
TechInsights reports provide the level of competitive analysis you require, from product- level teardown and bill-of-materials analysis to detailed, die-level structural, process and circuit information.
Our team of subject matter experts track the consumer electronics market to find innovative & disruptive semiconductor events. Our reports are used by finance, procurement, product marketing, product managers, architects and designers to:
TechInsights analyzes and reports on advanced technology products from the product-in-packaging level, to the atomic level.
We offer several report types, which provide different depths of analysis depending on the type of event, with deep levels of analysis required to identify process and circuit innovation.
The following table provides a list of example report types categorized by the depth of analysis required. The report types listed below are only a portion of the report types we have in our library.
All circuit reports include a PDF report plus our powerful CircuitVision interface. This provides a highly interactive, easy to navigate view of circuit design including the physical implementation on the integrated circuit. Hierarchical schematics are recreated in a way that mirrors developers’ design from the block down to the gate level – all linked to the original layout, showing the extracted gates and associated interconnects.