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The phone is in and our preliminary findings have been published. Follow our blog for updates as we continue to examine this phone.
Significant intellectual property has been developed around these algorithms related to error correction, read-retry techniques, wear leveling, garbage collection, data flush, and data trimming, amongst others.
Apple, Huawei and Samsung – TechInsights has conducted an in-depth analysis of each provider’s most recent contenders.
The Intel 545S SSD, introduced in June 2017, was the first product to include the Intel/Micron 64L 3D NAND, and one of the first SSD to use 64L.
While Apple and Samsung have been engaged in a tug-of-war for the title of top-selling smartphone provider over the past couple of years, China’s dominant OEM - Huawei - has been quietly gaining traction globally with their P- and Mate-series offerings.
Huawei’s Mate 10 is here, and TechInsights has torn it down to bring you our deep-dive technical analysis, board shots, costing and news of chip socket wins.
Come check out what is inside Apple's latest wearable. You will find annotated board shots, with commentary on design wins and more.
TechInsights has completed our initial analysis of the Apple iPhone 8 Plus – the Intel version of the phone.
These structures are critical to the performance of 1.0 µm to 1.4 µm generation pixels in smartphone cameras.
Read on for an analysis of what this acquisition means to the patent portfolio of Qualcomm.
TSMC 10 nm was found in the Apple A10X processor (APL1071) found in the Apple iPad Pro 10.5 (MQDT2CL/A).
3D XPoint technology was unveiled by Intel and Micron in August 2015, creating the first new memory category in more than 25 years.
The Qualcomm Snapdragon 835 applications processor found in the Samsung Galaxy S8 is confirmed to be built on Samsung’s 10 nm LPE process...
The WTR5975 is a member of the Snapdragon 835 family found in the Samsung Galaxy S8 and is the world’s first single-chip RF IC supporting Gigabit Class LTE, LTE-U, and LAA with 5 GHz unlicensed band support.
The W1 chip found in the Beats Studio wireless headphone has the package mark 343S00131. Meanwhile, the W1 chip torn down from the Apple AirPods has the package mark 343S00130.
In this exclusive analysis piece, IAM provides a detailed look at each company’s patent position, as well as a summary of the big issues they have faced over the last five years.
As microchips become 3-D, there are dividends in performance, power consumption and capabilities.
It is interesting to see what the cost differences are and how much more money Apple makes by selling an X, especially when millions or tens of million units are involved.
Apple Inc’s new flagship iPhone X makes the company more money per phone than its iPhone 8 model, according to an analysis, which found the iPhone X’s flashier parts cost Apple 25 percent more than the iPhone 8, but that it retailed 43 percent higher.
Apple continues to use a mix of Qualcomm and Intel cellular baseband processors in the iPhone X. Teardowns of the handsets also show that the company employed a combination of new and old tricks to pack features into its new flagship smartphone.
Martin Bijman, Director, Intellectual Property Products, TechInsights, explores the factors involved in understanding and determining the value of your patent portfolio, concentrating closely on the importance of subject matter experts to do so.
The technologies to watch identified by TechInsights analysts at the beginning of the year have not been disappointing.
TechInsights explored some of the Bluetooth and cellular IoT devices that it expects will dominate the Internet of Things for some time.
Patent portfolios require contant monitoring, amending and culling in order for businesses to keep pace with their competitor, says John Boyd of TechInsights.
With a history stretching back more than 60 years, the IEEE International Electron Devices Meeting (IEDM) is the world’s pre-eminent forum for reporting technological breakthroughs in the areas of semiconductor and electronic device technology, design, manufacturing, physics, and modeling. IEDM is the flagship conference for nanometer-scale CMOS transistor technology.
Taking place in Amsterdam in March 2018, the event will provide IP owners in Europe with tools and insights that will enable them to craft world-class IP management and value creation programmes.
IPBC Global has cemented itself as the global gathering for the world’s IP business leaders since it was first held back in 2008. From June 10 to 12 2018, IPBC Global will enter its second decade when the world’s IP elite will assemble at the Palace Hotel, San Francisco for the 11th annual event.