Technical Intelligence

  • TechInsights can analyze the design of an entire device, focus on specific circuit blocks, or provide a technical device snapshot. With circuit extraction and analysis as our core business, we recognize the tremendous strategic value of having the right information, at the right time.

    TechInsights has made a significant investment in tools and techniques to accelerate our own analysis efforts and to better understand device functionality and structure. We also have analytical capabilities that span from silicon to software to electronic systems. We have a huge arsenal of sophisticated test equipment and tooling, much of which is proprietary, to ensure accurate and timely analysis for our clients.

    CircuitVision

    CircuitVision Reports are a new report type delivering new content and functionality. For the first time, clients are provided with a complete physical and electrical view of the circuitry. CircuitVision Reports feature reconstructed layout information, linked directly with the electrical schematics. CircuitVision Reports offer readers the ability to search and index signals, trace signals from schematic to schematic, and to move up, down, and across the schematic hierarchy. This fast and interactive approach provides readers with an unprecedented ease and understanding of a chip’s design.

    IRIS

    IRIS a web-based platform that enables users to query over 30,000 products in order to generate a bill of materials (BOM) and quickly pinpoint specific devices, components, and functions. Read more about IRIS.


    Process

    We have done process analysis in technologies that include CMOS, BiCMOS, Bipolar, SiGe, GaAs, CCDs, LCDs & photovoltaic, to name a few. Here is a detailed description of the techniques employed by TechInsights’ process analysis department. For chip-level work we depend upon a wide variety of in-house and external lab services:

    • In-house Lab Services: Optical microscopy; Scanning electron microscopy and field emission scanning electronic microscopy (SEM and FESEM);  Transmission electron microscopy (TEM);  scanning capacitance microscopy (SCM); energy dispersive x-ray spectroscopy (EDS);  package x-ray; advanced, proprietary sample preparation including device de-encapsulation,  thinning, sectioning and de-layering, including reactive ion etching (RIE);  sub-micron device probing (nanoprobing) and electrical measurement.
    • External Lab Services (under contract):  focused ion beam analysis and microsurgery (FIB);  auger analysis;  secondary ion mass spectroscopy (SIMS); scanning probe microscopy;  spreading resistance probe measurement (SRP); wavelength dispersive spectrometry (WDX); electron beam induced current (EBIC);  Rutherford back scattering (RBS);  Raman spectroscopy.

    For semi-automated circuit analysis we have proprietary tooling that manages image capture, stitching, and alignment, layout creation, productivity enhancing circuit extraction, cell extraction, netlist navigation & query tools and schematic library searching.

    Software & Systems

    Disassemblers, decompilers, in-circuit emulators, protocol analyzers, common hardware platform development and debug tools, logic analyzers, scopes, and hardware simulation capabilities are a few examples of software and system-level tooling for analyses.

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